Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the developmentFor these reasons the military has established visual inspection criteria specifying cracks and chip-outs as re- jectable. Some methods for repairing glass chip-outs have been tried. The most common is to cover the chipped-out area with ananbsp;...
Title | : | Handbook of Electronic Package Design |
Author | : | Michael Pecht |
Publisher | : | CRC Press - 1991-08-16 |
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